Intel shares biggest unboxing video ever as ASML’s $380 million High-NA lithography machine is installed in Oregon fab By Anton Shilov published 4 March 24 Intel posts video showing the arrival and installation of its cutting-edge High-NA lithography machine.
ASML ships groundbreaking new chipmaking tool to Intel — High-NA lithography tool needed for next-gen process nodes could cost ~$400 million By Anton Shilov published 21 December 23 ASML on Thursday announced that it had begun shipping the industry's first extreme ultraviolet (EUV) lithography tool with a 0.55 numerical aperture (High-NA) to Intel.
ASML warns that more U.S. sanctions against China could have a major impact on its business By Anton Shilov published 14 February 24 ASML's backlog in China totals tens of billions of dollars, but geopolitical tensions could impact the company's ability to fulfill it.
Intel has processed 30,000 wafers with High-NA EUV chipmaking tool By Anton Shilov published 25 February 25 Intel says ASML's High-NA EUV tools have produced 30,000 wafers in a single quarter.
ASML accelerates 50-football-fields-size mega expansion plans in the Netherlands By Mark Tyson published 8 May 25 ASML appears to have accelerated its ambitious expansion plans in the Netherlands. The site may be in action up to two years early.
Dutch government minister talks about China's military advantage — May point to stricter sanctions in the future By Anton Shilov published 20 February 24 Dutch government continues to grant ASML export license to ship litho tools to Chinese customers, but raises concerns about military and economic risks.
US, China Chip War may continue for decades, says former ASML CEO — Wennick shares insights from selling chipmaking gear to both sides By Dallin Grimm published 8 July 24 The Chip War is fought over ideology, not factual basis, says tech boss
Netherlands tightens export controls on sanctioned semiconductor equipment — move made in line with U.S. limitations, ASML will apply for licenses from the Dutch government By Jowi Morales published 15 January 25 The Netherlands expands its export controls on measuring and inspection equipment to ensure that ASML applies for licenses locally, not in the U.S.
ASML claims US ban on servicing China chipmaking tools will not hurt the company By Anton Shilov published 27 April 24 The Dutch government may ban ASML from servicing high-end wafer fab tools in China, but the outgoing ASML CEO says this will not be a major problem for earnings.
Imec patterns first logic and DRAM transistors using High-NA litho tools By Anton Shilov published 7 August 24 ASML and Imec successfully demonstrate high-resolution patterning using High-NA EUV tools.
Russia plans EUV chipmaking tools that it says will be cheaper and easier to build than ASML's — country outlines new roadmap to smaller chips By Anton Shilov published 18 December 24 Russia to develop lithography systems that could compete against ASML's Twinscan NXE EUV systems.
TSMC Asks Partners to Delay Fab Equipment Deliveries: Report By Anton Shilov published 15 September 23 TSMC asks to delay delivery of chipmaking tools because of demand uncertainties and Fab 21 setback.
ASML explores Hyper-NA chipmaking tools as the next step in shrinking transistors — tools would debut in 2030, but significant technology and cost hurdles remain By Anton Shilov published 16 February 24 ASML mulls Hyper-NA lithography with a higher than 0.7 numerical aperture in 2030s.
Intel is buying leading-edge lithography tools — report says Intel will acquire 6 of 10 High-NA EUV tools produced by ASML next year By Anton Shilov published 20 December 23 Intel is gearing up to be high-NA EUV lithography champ with orders for six additional Twinscan EXE machines.
Russia bypasses sanctions and obtains spare parts for decades old ASML chip making machines: Report By Anton Shilov published 5 September 24 Russian companies get spare parts for ASML's PAS 5500 lithography steppers from 1990s – 2000s through China-based intermediaries.
Corning's Extreme ULE glass debuts for next-gen High-NA EUV chipmaking By Anton Shilov published 2 October 24 Corning introduces new Extreme ULE glass for photomasks and mirrors to be used with next-generation EUV and High-NA EUV tools.
Pat Gelsinger turns to particle accelerators for a new way to make chips, joins xLight By Anton Shilov published 13 April 25 Pat Gelsinger is back in the semiconductor game with xLight, a company that plans to make an EUV light source using a collider.
Atomic-scale chip alignment: Laser holograms could set new standard for 3D semiconductor overlay accuracy By Anton Shilov published 15 April 25 Tech could lower manufacturing costs by simplifying one of the most complex steps in chip production and 3D chip integration.
TSMC's first High-NA EUV litho tool to begin installation this month say industry insiders By Anton Shilov published 10 September 24 TSMC to start installing High-NA EUV system for R&D purposes this month.
Russian spy infiltrates ASML and NXP to steal technical data necessary to build 28nm-capable fabs By Anton Shilov published 2 April 25 A Russian engineer is accused of leaking confidential technical data from ASML, NXP, TSMC, and GlobalFoundries to Russia, allegedly to support construction of a 28nm-capable fab.
China's SMEE files patent for an EUV chipmaking tool — tool aims to break the shackles of ASML export restrictions By Anton Shilov published 13 September 24 Shanghai Microelectronics Equipment patents key components of an EUV lithography tool.
Intel completes assembly of first commercial High-NA EUV chipmaking tool — addresses cost concerns, preps for 14A process development in 2025 By Paul Alcorn published 18 April 24 Intel Foundry announced it had completed the assembly of the industry's first commercial High Numerical Aperture (High-NA) Extreme Ultraviolet (EUV) machine in its D1X fab in Oregon.
Chinese companies poach staff from ASML and Zeiss with three times higher pay — employees needed to design and build chipmaking tools amid sanctions By Anton Shilov published 28 November 24 Chinese companies aggressively recruiting personnel from ASML and Zeiss to build their own wafer fabbing equipment.
Chinese Firm's 'Breakthrough' 28nm Chipmaking Tool to Debut Soon: Report By Anton Shilov published 2 August 23 Shanghai Micro Electronics Equipment Group could start selling a 28nm-capable lithography tool by end of 2023.
Rapidus is first Japanese company to install ASML's cutting-edge EUV machine — chipmaking tool for 2nm chips expected to be operational in early 2025 By Anton Shilov published 19 December 24 Rapidus gets ASML's Twinscan NXE:3800E, almost completes its installation.
China Scolds Netherlands For New Chipmaking Tool Ban By Anton Shilov published 1 July 23 China wants the Dutch government not to impose new export rules that ban sales of advanced DUV tools to the People's Republic.
The U.S. has sanctioned 18 Chinese fabs, dozens remain in white zone By Anton Shilov published 31 July 24 The U.S. government approves shipments of wafer fab equipment to many Chinese fabs, other are banned. Question is, can those tools be installed in banned fabs?
Chinese company claims chipmaking tool breakthrough — announces 28nm-capable litho tool By Anton Shilov published 20 December 23 Shanghai Micro Electronics Equipment Group claims to have developed a 28nm-capable lithography machine for chip manufacturing, a breakthrough for the Chinese tech industry.
New 'stamping' chipmaking technique uses 90% less power than EUV — Canon to ship the first nanoimprint litho tools to customers this year or next By Anton Shilov published 31 January 24 Canon's nanoimprint lithography tools will ship either this year or next, they will address 3D NAND manufacturing first.
China's chipmaking tool purchases skyrocket — imports up 256% in the face of intensifying U.S. sanctions By Anton Shilov published 28 March 24 Chinese companies accelerate procurement of ASML's litho tools in January and February.