Latest about RAM
Silicon Power launches its first CUDIMM high-performance DDR5 with speeds of up to 9200MT/s
Silicon Power has unveiled two new DDR5 XPOWER memory modules, its first to feature CUDIMM technology.
Samsung to adopt hybrid bonding for HBM4 memory
Samsung plans to adopt hybrid bonding for HBM4 to improve thermal and interface performance, potentially gaining a competitive edge over SK hynix, which may delay its use due to costs concerns.
Corsair Vengeance RGB CUDIMM DDR5-8400 C40 2x24GB Review: Shiny and speedy but on the pricey side
There are many high-speed memory kits on the market, but can the Vengeance RGB CUDIMM DDR5-8400 C40 stand out?
G.Skill Trident Z5 CK DDR5-8800 C42 2x24GB Review: Top-Tier Performance With A Price Tag To Match
The G.Skill Trident Z5 CK DDR5-8800 C42 is one of the fastest retail DDR5 memory kits; however, can it beat the best of the best?
3D X-DRAM aims for 10x capacity of today's memory — NEO Semiconductor's memory has up to 512 Gb per module
NEO Semiconductor has announced progress on its new 3D X-DRAM technology, with new 1T1C and 3T0C chip designs increasing DRAM speeds by an order of magnitude for tomorrow’s top-end computing.
Samsung discontinuing DDR4 production in late 2025 — company to focus on DDR5, LPDDR5, and HBMs
Samsung is ending DDR4 production in favor of more lucrative technologies like DDR5 and HBM.
G.Skill debuts world's first 256GB (64GBx4) DDR5-6000 CL32 UDIMM memory kit with EXPO support
G.Skill has launched the first 256GB (64GBx4) UDIMM memory kit, hitting DDR5-6000 CL32 speeds out-of-the-box with EXPO.
JEDEC finalizes HBM4 memory standard with major bandwidth and efficiency upgrades
HBM4 offers faster data rates, more channels, and higher memory capacities, with features like Directed Refresh and flexible voltage options to boost performance and reliability.
